Eq. (1): HI = 60·V·A / (1000·S) [kJ per in. or per mm] Eq. (2): HI = E_I / L (waveform-controlled) Eq. (3): HI = P_I·T_s / (1000·L) (waveform-controlled)

CE(IIW) = C + Mn/6 + (Cu+Ni)/15 + (Cr+Mo+V)/5 Pcm = C + Si/30 + (Mn+Cu+Cr)/20 + Ni/60 + Mo/15 + V/10 + 5B

D = S · t / k

in. in.

w = c·(F + a) / b + a (Eq. 4)

t* = min(t₁, t₂) + Δr (11.1.5) Wire: Tables 17/18 Hole: Table 19 (2T)

in. in.

in.

σf = σy · [ 1 + (21.75/σy)^2.30 ] Pf = σa / σf Y/T = 1 / [ 1 + 2·(21.75/σy)^2.30 ] εt = −0.00175·σy + 0.22 n = ln(εt/0.005) / ln{ 1/(Y/T) } dn = 3.69/n² − 3.19/n + 0.882

Kr = f(Lr) = (1 − 0.14·Lr²) · [ 0.3 + 0.7·exp(−0.65·Lr⁶) ] Lr^cutoff = σf / σy Kr = √(δe / δmat) δe = dn·Je/σy Je = K₁²(1−ν²)/E K₁ = σa·√(πa)·Fb Lr = σa / σc σc = [ π/4 + 385(0.05−ηβ)^2.5 ]·[cos(ηβπ/2) − ηsin(βπ)/2]·σy (ηβ < 0.05)

Fb(α,β,η): ηc = max(η, 0.1); βc = min(β, 80ηc/(πα)) m₁ = −0.00985 − 0.163ηc − 0.345ηc² m₂ = −0.00416 − 2.18ηc + 0.155ηc² Fb = 1.09 + 2.31·α^0.791·βc^0.906·ηc^0.983 + m₁/(αβc) + α^0.806·βc·m₂ α = D/t β = 2c/(πD) η = a/t

1: s < 2c₁ → a₋ = a₂, 2c₋ = 2c₁+s+2c₂ 2: s₁ < 2c₁ ∧ s₂ < a₁+a₂ → 2a₋ = 2a₁+s₂+2a₂, 2c₋ = 2c₁+s₁+2c₂ 3: s₁ < 2c₁ ∧ s₂ < a₁+a₂ → a₋ = 2a₁+s₂+a₂, 2c₋ = 2c₁+s₁+2c₂ 4: d < a → a₋ = d+2a, 2c₋ = 2c 5: s₁ < min(2c₁,2c₂) ∧ s₃ < min(2a₁,2a₂) → 2a₋ = 2a₃, 2c₋ = 2c₁+s₁+2c₂

N = 0.10·t C = 11.357·t + 2 in. (50 mm) R1 = OD / 2 R2 = R1 − 0.9·t

in.

S* = N₁(Δσ₁)³ + N₂(Δσ₂)³ + ... + Nₖ(Δσₖ)³ (Δσ in ksi)

in. in.

t_e = (2·t_s + t_a) / 3 (Eq. B.1)

in. in.